HYBRID INTEGRATED CIRCUIT DEVICE

摘要

PROBLEM TO BE SOLVED: To solve the problem of size bulkiness of a hybrid IC device using a metal substrate with the backside of the metal substrate exposed and a heat radiating film provided on the exposed surface. SOLUTION: A desired circuit is achieved by providing a first circuit element group on the surface of a metal substrate 13, and a second circuit element group on the backside of the metal substrate. The surface and backside coating resins, and the side covering resin are formed integrally with a transfer mold. A third arrangement region B on the backside has the substrate backside exposed with a heat radiating film 21 provided therein. COPYRIGHT: (C)2009,JPO&INPIT