| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of producing a polyimide film which is prepared by applying a solvent or a polyamic acid solution to a self-supporting film, and does not cause cracks by the application. SOLUTION: In the method of producing polyimide film having the thickness of 5-20μm, an organic solution is applied to at least one side surface of the self-supporting film and afterward, the self-supporting film is heated in a heating furnace to be imidized. The method of producing polyimide film is characterized in that the self-supporting film is obtained by heating and drying the thin film of the polyamic acid solution where an imidization catalyst is compounded by 0.02-0.5 mol with respect to the amic acid of 1 mol in the polyamic acid, and solution time is 40 sec or more. COPYRIGHT: (C)2009,JPO&INPIT |
