发明名称 METHOD AND APPARATUS FOR CLEANING DEPOSITION CHAMBER PARTS USING SELECTIVE SPRAY ETCH
摘要 PROBLEM TO BE SOLVED: To provide a method and an apparatus of cleaning films deposited on the surfaces of constitutive parts of a treating apparatus. SOLUTION: In one aspect, a method of cleaning an electronic device manufacturing process chamber part is provided, including (a) spraying an unintentional coating 106 on the uppermost surface of the chamber part with an acid; (b) pressure spraying the residual coating 106 with deionized water; and (c) treating an intentional coating 104 being an under layer of the coating 106 with potassium hydroxide. Other aspects are provided. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009007674(A) 申请公布日期 2009.01.15
申请号 JP20080169157 申请日期 2008.06.27
申请人 APPLIED MATERIALS INC 发明人 BAO LIYUAN;LOO KEN MUN;TAN SAMANTHA S H
分类号 C23C14/00;C23C16/44;H01L21/3065;H01L21/31 主分类号 C23C14/00
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