| 摘要 |
A glass processing method comprising steps (i), (ii) carried out in the order mentioned. In step (i), a laser pulse (11) with a wavelength lambda is condensed by a lens and is applied to a glass plate (12) to form an altered portion (13) at the portion, irradiated with a laser pulse (11), of the glass plate (12). In step (ii), the altered portion (13) is etched by using an etchant having an etching rate larger for the altered portion (13) than that for the glass plate (12). The laser beam used includes the following conditions: The pulse width of a laser pulse (11) ranges from ins to 200 ns, with a wavelength lambda being up to 535 nm. The absorption coefficient of the glass plate (12) at a wavelength lambda is up to 50 cm-1. A value obtained from a lens focal distance L (mm) divided by the beam diameter D (mm) of the laser pulse (11) when entering the lens is at least 7.
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