| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin/filler composite material having a low coefficient of linear expansion and the resin fluidity suitable for lamination process, hence suitably applicable to an insulation material of a printed wiring board; and to provide a printed wiring board suitable for mounting a high performance semiconductor device. SOLUTION: This resin/filler composite material comprises (A) a thermoplastic polyimide resin component, (B) a thermosetting resin component and (C) a spherical silica filler. The spherical silica filler (C) has≤1μm average particle diameter and has been treated with an aminosilane-based coupling agent. COPYRIGHT: (C)2009,JPO&INPIT |
