| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a resin varnish which can realize an adhesive layer-coated metal foil which can form an adhesive layer with very few spots even when applied to a lowly roughened foil and can form a printed wiring board capable of fully reducing a transmission loss in a high-frequency band, excellent in heat resistance, and excellent in strength of bonding between an insulation layer and an electroconductive layer and, in a multilayer printed wiring board, among layers and an adhesive layer. <P>SOLUTION: The resin varnish is one for forming the adhesive layer of an adhesive layer-coated metal foil composed of a metal foil and an adhesive layer formed thereon and comprises (A) a polyfunctional epoxy resin, (B) a polyfunctional phenolic resin, (C) a polyamide-imide, and a solvent, wherein the solvent comprises (D) a nitrogen-containing solvent and (E) a ketone solvent. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
