| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a multilayer printed circuit board which can mount a component and can perform wiring between the input and output of signal by an impedance control wiring layer of good high frequency characteristics suitable for high-speed transmission. <P>SOLUTION: The multilayer printed circuit board of three or more layers capable of mounting an electronic component comprises a component mounting wiring layer made of at least two kinds of insulating material of different properties and capable of mounting an electronic component, and an impedance control wiring layer designed to control the characteristic impedance wherein a field via is provided for interlayer conduction by placing a copper ball in a hole bored in the insulation layer, arranging a copper foil on the opposite sides of the insulation layer and then collapsing the copper ball by pressing. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
