| 摘要 |
PROBLEM TO BE SOLVED: To enable an identification mark to be read, even if the main surface side of a wafer on which the identification mark is formed is sealed with resin. SOLUTION: A device reads the identification mark 20 while a main surface 1c, containing the identification mark 20, is being sealed by a resin layer 1h by forming the irregular identification mark 20 on a main surface 1c of the wafer 1. The device comprises a plurality of illumination units 13A, 13B for emitting infrared rays toward the main surface 1c from the side of a back 1b in the wafer 1; and an imaging unit 16 for imaging a junction interface by receiving the reflected light of infrared rays reflected on the junction interface between the main surface 1c and a resin layer 1h through the wafer 1. The reader A of the identification mark 20 is provided, where light axes R1, R2 in the plurality of illumination units 13A, 13B cross the main surface 1c, in mutually different directions, and the imaging unit 16 receives only the reflected light of a plurality of infrared rays that are reflected in the same direction on the junction surface. COPYRIGHT: (C)2009,JPO&INPIT
|
