METHOD FOR MANUFACTURING NOZZLE SUBSTRATE, METHOD FOR MANUFACTURING DROPLET DISCHARGE HEAD, AND SUBSTRATE PEELING DEVICE

摘要

PROBLEM TO BE SOLVED: To reduce wafer chipping or cracking of a nozzle substrate as much as possible during peeling thereof from a support substrate in manufacturing of the nozzle substrate. SOLUTION: The method comprises steps of forming a nozzle hole with minor diameter at the top end and major diameter at the rear end by etching from one surface of a silicon substrate 100 that forms the nozzle substrate to the middle thereof to open the nozzle hole rear end to the one surface of the silicon substrate 100; sticking the support substrate 112 to the nozzle hole rear end-side surface of the silicon substrate 100 through a double-sided adhesive sheet 110 having a self-release layer; thinning the nozzle hole top end-side surface of the silicon substrate 100 to open the nozzle hole top end; and peeling the silicon substrate 100 from the support substrate 112 by external force while exposing the double-sided adhesive sheet 110 with light or heat and generating interface peeling by growth of bubbles in the self-release layer of the double-sided adhesive sheet 100. COPYRIGHT: (C)2009,JPO&INPIT