HIGH FREQUENCY MODULE HAVING SHIELDING AND HEAT DISSIPATING CHARACTERISTICS AND METHOD FOR MANUFACTURING THE SAME

摘要

Provided is a high frequency module, which has shielding characteristics, highly dissipates heat and is easily miniaturized and thinned and manufactured at low cost. A method for manufacturing such high frequency module is also provided. In a high frequency module (1), a circuit pattern, which includes a ground pattern (3a), and an electronic component (4) are arranged on a main surface of a substrate (2), and then a resin mold (7) and a shield layer (8) are arranged thereon. The shield layer (8) is made of a conductive resin, and a lower end of the shield layer is connected to the ground pattern (3a). In the manufacturing method, a large-area substrate having a plurality of unit sections is used, and a circuit is previously formed in each unit section. Then, the substrate is cut and separated after being subjected to steps of resin molding and conductive paste printing.