SOLDER BUMP

摘要

A solder bump is provided to prevent mechanical strength of the solder bump from decreasing by sequentially forming a copper post, silver plating layers and tin plating layers, thereby suppressing the production of Ag3Sn that is an intermetallic compound produced on an interface of the copper post and a solder. A solder bump(30) comprises a copper post(2), silver plating layers(4,8), and tin plating layers(6,10). The copper post is formed on a metal layer(12) forming an electronic component through the electroplating process. The silver plating layers and tin plating layers are sequentially formed on the copper post. The metal layer means a circuit pattern formed on a printed circuit board or a wafer level package. The solder bump further comprises a gold plating layer(14) formed between the metal layer and the copper post.