METHOD FOR MANUFACTURING HIGH-ASPECT-RATIO MICRO STRUCTURES

摘要

A method for preparing a microstructure of high aspect ratio is provided to the photoresist for plating to be patterned precisely without the deterioration of resolution by removing the Fresnel diffraction of UV rays completely. A method for preparing a microstructure of high aspect ratio comprises the steps of (S110) preparing a transparent substrate coated with a transparent conductive layer; (S120) forming a metal mask pattern on the transparent conductive layer; (S130) coating a photoresist for plating so as to surround the metal mask pattern; (S140) irradiating UV rays to the lower part of the transparent substrate to form a mold at the photoresist for plating; and (S150) plating it so as to fill the mold, thereby forming a microstructure.