发明名称 Producing method of suspension board with circuit
摘要 A producing method of a suspension board with circuit includes simultaneously forming a conductive pattern formed on an insulating layer formed on a metal supporting board and having a terminal portion for connecting to an electronic component, and a mark formed on the metal supporting board, or on the insulating layer and having an opening for forming a reference hole for mounting the electronic component, and forming the reference hole by etching the metal supporting board disposed in the opening of the mark, or the insulating layer and the metal supporting board each disposed in the opening of the mark.
申请公布号 US2009014410(A1) 申请公布日期 2009.01.15
申请号 US20080216589 申请日期 2008.07.08
申请人 NITTO DENKO CORPORATION 发明人 YOKAI TAKAHIKO;OOYABU YASUNARI;NAITO TOSHIKI
分类号 H01B13/34 主分类号 H01B13/34
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