| 摘要 |
A method of removing an insulation layer pattern covering metal wires includes providing an insulation layer pattern on a substrate, the insulation layer pattern having openings exposing the substrate, forming metal wires in the openings by depositing a barrier layer on inner surfaces of the openings, such that a lower portion of the barrier layer is thinner that an upper portion of the barrier layer, and depositing a metal layer to fill the openings, and performing an etching process with an etching vapor to remove the insulation layer pattern from the substrate to expose the metal wires.
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