SOLID STATE IMAGING DEVICE IN WHICH A PLURALITY OF IMAGING PIXELS ARE ARRANGED TWO-DIMENSIONALLY, AND A MANUFACTURING METHOD FOR THE SOLID STATE IMAGING DEVICE

摘要

A solid state imaging device includes a plurality of imaging pixels that are arranged two-dimensionally along a main face of a semiconductor substrate. Each imaging pixel in the solid state imaging device includes a photodiode that performs photoelectric conversion and a color filter that is disposed higher in the Z axis direction than the photodiode. Also, light blocking portions have been formed between pairs of adjacent imaging pixels, on the main face of the semiconductor substrate to a height in a thickness direction (Z axis direction) of the semiconductor substrate that is substantially equal to or higher than top edges of the optical filters. Each light blocking portion is constituted from a combination of a light blocking film and a light blocking wall.