| 摘要 |
PROBLEM TO BE SOLVED: To provide an electron device mounting method that is excellent in alignment mark recognition during dicing and during flip-chip bonding and has high reliability in electrical connection using an adhesive composition for an electron device. SOLUTION: The electron device mounting method is configured to bring each bump formed on an electron device into contact with each electrode pad formed on a mounting circuit board so as to connect them with each other. An electron device substrate has a plurality of electron devices and each adhesive layer for an electron device that has a light transmittance of≥70% and≤100% and is formed on a bump forming face. The method has at least (A) a step for dividing the electron device substrate into individual pieces by dicing, (B) a temporary pressure-bonding step for executing electrical connection between each bump and each electrode pad by pressure-bonding each electron device having the adhesive layer for an electron device to each electrode pad on the mounting circuit board at a prescribed temperature, and (C) an actual pressure-bonding step for curing each adhesive layer for an electron device. COPYRIGHT: (C)2009,JPO&INPIT
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