| 摘要 |
PROBLEM TO BE SOLVED: To reduce thermal stress crack caused by a leak between a plurality of heat generating resistors due to input of excess current, by increasing the heat capacity of each insulation layer. SOLUTION: The heating body includes: a substrate 1a; the heat generating resistors 1b-1 and 1b-2 that are arranged parallel to each other in their width direction perpendicular to the lengthwise direction of the substrate, each resistor being disposed along the lengthwise direction of the substrate and generating heat by the supply of power; conductor sections 1c-1, 1c-2, and 1c-3 connected to one and the other ends of the heat generating resistors in the lengthwise direction of the substrate; and the insulation layers 1d-1 and 1d-2 covering the heat generating resistors and conductor sections. The insulation layers have spaces S between the heat generating resistors and conductor sections in the lengthwise direction of the substrate. In this heating body, each of the insulation layers has at least one part T1, T2 of the surface of the heat generating resistor thicker than the other area. COPYRIGHT: (C)2009,JPO&INPIT
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