<p>The present invention may provide a circuit substrate containing an insulating resin layer, wherein said insulating resin layer contains polyimide and a clay mineral, said insulating resin layer has an elastic modulus of not less than 0.3 GPa and not more than 30 GPa at 450 degrees C and said insulating resin layer with a thickness of 20 micrometers has a light transmittance of not less than 40 % at a wavelength of 650 nm.</p>
申请公布号
WO2009008029(A1)
申请公布日期
2009.01.15
申请号
WO2007JP00749
申请日期
2007.07.10
申请人
MITSUI CHEMICALS, INC.;AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH;TAKAKI, TOSHIHIKO;FUKUDA, KAZUYUKI;HE, CHAOBIN;MYA, KHINE YI
发明人
TAKAKI, TOSHIHIKO;FUKUDA, KAZUYUKI;HE, CHAOBIN;MYA, KHINE YI
