| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a flexible printed wiring board capable of decreasing unevenness of an insulating layer, improving flexibility and suppressing generation of warpage. SOLUTION: In the method for manufacturing the flexible printed wiring board which laminates the insulating layer 5 on the surfaces of a substrate 2 and a conductive body 3 by performing a heating and pressing processing by a press-bonding member 14, and sticking an adhesive layer 6 of the insulating layer 5 composed of the adhesive layer 6 comprising a thermosetting resin as a main component and an insulating film 7 laminated on the surfaces of the adhesive layer 6 on the substrate 2 and the conductive body 3 provided on the surface of the substrate 2, the heating and pressing processing by the press-bonding member 14 is performed by placing a cushioning material 12 with a hardness of 60-90 by a Rockwell hardness (a scale R) between the press-bonding member 14 and the insulating layer 5. COPYRIGHT: (C)2009,JPO&INPIT
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