FORMING METHOD OF CONDUCTIVE FILM, AND CONDUCTIVE FILM

摘要

PROBLEM TO BE SOLVED: To provide a forming method of a conductive film capable of increasing a film thickness of the conductive film and expanding an allowable error range of its film thickness while maintaining original chemical characteristics and retaining electric resistance in an allowable range. SOLUTION: The forming method of the conductive film has a process (step S2) in which a solution obtained by dispersing a plurality of metal complexes and a plurality of non-metal particulates having higher electric resistance than the metal complexes in solvent is injected toward a undercoat member as liquid droplets and in which the liquid droplets are made to land at the undercoat member, and a process (steps S4, S6) in which the liquid droplets made to land on the undercoat member are dried. COPYRIGHT: (C)2009,JPO&INPIT