发明名称 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
摘要 A substrate processing apparatus includes a development part for performing a development process on a substrate after being subjected to exposure and a cleaning part. When the processing time in the development part is shorter than the reference time determined in advance, the development part performs all the process steps for development. On the other hand, when the processing time in the development part is longer than the reference time, the development process is split into a first half process step and a second half process step, and the development part performs a processing including the first half process step and the cleaning part performs a processing including the second half process step. Even if the development process takes a long time, it is possible to prevent deterioration in processing capability of the substrate processing apparatus on the whole by splitting the development process.
申请公布号 US2009014126(A1) 申请公布日期 2009.01.15
申请号 US20080170406 申请日期 2008.07.09
申请人 SOKUDO CO., LTD. 发明人 OHTANI MASAMI;KOYAMA YASUFUMI
分类号 H01L21/306;B05C11/00;B08B3/00;H01L21/67 主分类号 H01L21/306
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