PHOSPHOR PACKAGE OF LIGHT EMITTING DIODES

摘要

A phosphor package of light emitting diodes includes a lens made of a transparent optical material, and a side of the lens with at least one phosphor containing groove corresponding to a light emitting diode chip. The concentration of the phosphor is adjusted before a required quantity of phosphor is adhered into the phosphor containing groove. The phosphor is baked and solidified. A gel is filled into the gap between the wire-bonded light emitting chip and the phosphor for binding with each other to complete the manufacturing process of a phosphor package; and such manufacturing process can effectively and accurately control the phosphor to achieve high quality stability and color uniformity.