| 摘要 |
A method of cleaning substrates and substrate cleaner is provided to increase the efficiency of removing particle without damage to a micro-pattern of the substrate. A cleaning device of substrate by the batch type dip process includes a wet etchant process bath(4), an ultrasonic clean bath(7), a drying section(9) and a robot returning the substrate(6) for each processing. One batch is composed of a single substrate or a plurality of substrate, and it is dipped in the wet etchant at the substrate, and then the ultrasonic cleaning process is performed and a dry process is performed. At this time, the ultrasonic cleaning uses cleaning water which is 60 % or 100 % of the degree of saturation of the dissolved gas in the atmospheric pressure. The frequency of the ultrasonic wave is over 500 Khz, and the output of the ultrasonic wave is 0.02 W / cm^2 or 0.5 W / cm^2.
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