| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding apparatus for correcting displacement in X-axis, Y-axis andθ-axis directions of a component imaging means and a substrate imaging means for accurate alignment of an electronic component. SOLUTION: The bonding apparatus includes the component imaging means, the substrate imaging means and a target 8 with an alignment mark. The target 8 and the both imaging means are relatively movable. A relative positional relation between the both imaging means is calculated from an image picked-up with the both imaging means coaxially positioned with the target 8 interposed therebetween to align a substrate with the electronic component based on the calculated relative positional relation. The alignment mark on the target 8 has two intersecting points apart from each other by a predetermined distance. The positions of two intersecting points are recognized from each picked-up image to calculate the relative positional relation between both imaging means from their displacement in the X-axis, Y-axis and rotating directions. COPYRIGHT: (C)2009,JPO&INPIT
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