发明名称 |
INTERCONNECTS FOR PACKAGED SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING SUCH DEVICES |
摘要 |
Packaged semiconductor devices and assemblies including interconnects and methods for forming such interconnects are disclosed herein. One embodiment of a packaged semiconductor assembly includes a die attached to a support layer. A plurality of interconnects are embedded in and project from the support layer, such that the support layer at least partially retains the interconnects in a predetermined array. An encapsulant is molded around each of the interconnects and encases at least a portion of the die, support layer and interconnects.
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申请公布号 |
US2009014859(A1) |
申请公布日期 |
2009.01.15 |
申请号 |
US20070848836 |
申请日期 |
2007.08.31 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
JEUNG BOON SUAN;POO CHIA YONG;KOON ENG MEOW |
分类号 |
H01L23/12;H01L21/56;H01L23/48 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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