| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light emitting device improved in heat dissipation. <P>SOLUTION: This light emitting device comprises a substrate, a plurality of light emitting diodes disposed on the substrate at intervals, projection portions for heat radiation projected on the substrate to be interposed between at least some of the plurality of light emitting diodes, and a phosphor-containing resin layer provided so as to cover the light emitting diodes and projection portions. <P>COPYRIGHT: (C)2009,JPO&INPIT |
