| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To obtain a lead pin mounting structure which readily enhances the reliability, after mounting, even when the lead pin in which a large current flows is mounted. <P>SOLUTION: When lead pins 3a-3d are mounted on a mounting board 1, on which a heat generating element 23 is mounted, a through-hole 1a is provided in the mounting board, a heat dissipating member 7, connected to the mounting board via a spacer 11, is arranged on the side opposite to the mounting surface on which the heat generating element is mounted of the mounting board; the rise in the temperature of the lead pin is suppressed by diffusing the heat to the periphery, even when a relatively large amount of Joule heat is generated in the lead pin, by connecting one end of each lead pin and allowing the through-hole to penetrate the board and solder 9 which connects the lead pin and the heat dissipating member 7 is prevented from being remelting, caused by the rise in the temperature of the lead pin. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
