| 摘要 |
PROBLEM TO BE SOLVED: To eliminate infiltration of resin into an airtight space portion and to stop a terminal electrode etc., from being cut owing to dicing by setting the thickness of a resin sheet used for a resin sealing stage while taking into consideration a printing shift between dicing marks printed on top and reverse surfaces of an aggregate substrate. SOLUTION: A piezoelectric component manufacturing method includes a stage of flip-chip mounting a SAW chip 2 with a bump 5 on a ceramic substrate 3, a stage of sticking a resin sheet 6 on the aggregate substrate after mounting by heat softening and further performing resin sealing by heat curing, and a stage of providing a dicing mark on the reverse surface of the aggregate substrate after mounting which was sealed/cured and cutting the aggregate substrate into pieces 1 using the dicing mark. The thickness of the resin sheet 6 before the resin-sealing stage is defined by a predetermined relational expression based upon a chip size, a top/reverse shift, a cutting margin, a SAW device size, a resin sealing layer thickness, etc. COPYRIGHT: (C)2009,JPO&INPIT |
