Manufacturing method for semiconductor device and manufacturing device of semiconductor device

摘要

The semiconductor manufacturing method includes the step (ST.1) of preparing a semiconductor substrate with a copper or copper-containing metal film exposed on a surface, step (ST.2) of depositing on the copper or copper-containing metal film a metal film consisting essentially of any one of CoWB, CoWP, or W; step (ST.3) of introducing Si into the above-described metal film, and step (ST.4) of nitriding the metal film introduced with Si.