发明名称 CONDUCTIVE FILM FOR IN-MOLD MOLDING AND METHOD OF MANUFACTURING PLASTIC MOLDED BODY WITH TRANSPARENT CONDUCTIVE LAYER
摘要 PROBLEM TO BE SOLVED: To provide a conductive film for transfer, which is suitably used to manufacture a plastic molded body with a transparent conductive layer by in-mold molding; and to provide a method of manufacturing the plastic-molded body with the transparent conductive layer by in-mold molding using the conductive film for transfer. SOLUTION: The conductive film for in-mold molding includes at least: a support 1; the transparent conductive layer 3 which is disposed on the support 1 and can be removed from the support 1; and a layer 5 of a thermally fusible resin disposed on the transparent conductive layer 3, wherein the transparent conductive layer 3 includes conductive fine particles and the thermally fusible resin impregnated between the conductive fine particles. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009009859(A) 申请公布日期 2009.01.15
申请号 JP20070171241 申请日期 2007.06.28
申请人 TDK CORP 发明人 KUROSE SHIGEO;SAKAMOTO RYUICHI;KOBAYASHI YOICHI
分类号 H01B5/14;B29C45/16;B32B7/02;B32B9/00 主分类号 H01B5/14
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