发明名称 |
CONDUCTIVE FILM FOR IN-MOLD MOLDING AND METHOD OF MANUFACTURING PLASTIC MOLDED BODY WITH TRANSPARENT CONDUCTIVE LAYER |
摘要 |
PROBLEM TO BE SOLVED: To provide a conductive film for transfer, which is suitably used to manufacture a plastic molded body with a transparent conductive layer by in-mold molding; and to provide a method of manufacturing the plastic-molded body with the transparent conductive layer by in-mold molding using the conductive film for transfer. SOLUTION: The conductive film for in-mold molding includes at least: a support 1; the transparent conductive layer 3 which is disposed on the support 1 and can be removed from the support 1; and a layer 5 of a thermally fusible resin disposed on the transparent conductive layer 3, wherein the transparent conductive layer 3 includes conductive fine particles and the thermally fusible resin impregnated between the conductive fine particles. COPYRIGHT: (C)2009,JPO&INPIT |
申请公布号 |
JP2009009859(A) |
申请公布日期 |
2009.01.15 |
申请号 |
JP20070171241 |
申请日期 |
2007.06.28 |
申请人 |
TDK CORP |
发明人 |
KUROSE SHIGEO;SAKAMOTO RYUICHI;KOBAYASHI YOICHI |
分类号 |
H01B5/14;B29C45/16;B32B7/02;B32B9/00 |
主分类号 |
H01B5/14 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|