| 摘要 |
PROBLEM TO BE SOLVED: To provide a reflow-soldering apparatus capable of reducing heat loss due to a conveyance means. SOLUTION: In the reflow-soldering apparatus for soldering a board 6 having an electronic component mounted while carrying it in a furnace 1 by the conveyance means, the conveyance means comprises belt conveyers 5 including a belt 14 and pulleys 13 and 15. The belt conveyers 5 are laterally juxtaposed at an interval and carry the board while supporting the right and left ends of the board 6. The belt conveyer 5 preferably has a board guide means (a board guide pin 17). In addition, it preferably has vertical belt guide means (a lower guide rail 21 and an upper guide rail 24) for guiding the vertical position of the belt 14. Moreover, it preferably has breadthwise belt guide means (guide grooves 22, 23 and 26 provided on the lower guide rail 21 and the upper guide rail 24, engagement pins 18 and 20 to be inserted into the grooves, and a belt guide pin 19) for guiding the breadthwise position of the belt 14. COPYRIGHT: (C)2009,JPO&INPIT |
