发明名称 EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing a semiconductor having excellent reflow crack resistance. SOLUTION: The epoxy resin composition for sealing the semiconductor comprises an epoxy resin, a curing agent, an inorganic filler and further a thiocresol. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009007415(A) 申请公布日期 2009.01.15
申请号 JP20070168026 申请日期 2007.06.26
申请人 PANASONIC ELECTRIC WORKS CO LTD 发明人 HIGASHINE MASAOKI
分类号 C08L63/00;C08G59/66;C08K3/00;C08K5/37;H01L23/29;H01L23/31 主分类号 C08L63/00
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