发明名称 |
HEAT TREATMENT APPARATUS |
摘要 |
Provided is a heat treatment apparatus. The heat treatment apparatus includes a heating plate including a heater; a chamber case including a cooling chamber, and coupled to a lower portion of the heating plate; and at least one atomizing unit installed on the chamber case to generate liquid droplet aerosol by mixing a cooling liquid and a gas, and at the same time, to inject the liquid droplet aerosol into the cooling chamber.
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申请公布号 |
US2009013698(A1) |
申请公布日期 |
2009.01.15 |
申请号 |
US20080236014 |
申请日期 |
2008.09.23 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM TAE-GYU;LEE DONG-WOO;LEE JIN-SUNG;PARK TAE-SANG;LEE BANG-WEON |
分类号 |
F25D31/00;H01L21/324;B05B7/04;B41J2/04;H01L21/00;H01L21/02 |
主分类号 |
F25D31/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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