发明名称 HEAT TREATMENT APPARATUS
摘要 Provided is a heat treatment apparatus. The heat treatment apparatus includes a heating plate including a heater; a chamber case including a cooling chamber, and coupled to a lower portion of the heating plate; and at least one atomizing unit installed on the chamber case to generate liquid droplet aerosol by mixing a cooling liquid and a gas, and at the same time, to inject the liquid droplet aerosol into the cooling chamber.
申请公布号 US2009013698(A1) 申请公布日期 2009.01.15
申请号 US20080236014 申请日期 2008.09.23
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM TAE-GYU;LEE DONG-WOO;LEE JIN-SUNG;PARK TAE-SANG;LEE BANG-WEON
分类号 F25D31/00;H01L21/324;B05B7/04;B41J2/04;H01L21/00;H01L21/02 主分类号 F25D31/00
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