发明名称 HOUSING COMPRISING A DEVICE FOR FIXING AN ELECTRONIC COMPONENT
摘要 The invention relates to a housing for receiving an electronic component (6), comprising a cover (1) and a plastic lower part (2). Said cover (1) is connected in a positive fit to the lower part (2) by means of a clamping geometry (3, 4, 5) and said cover (1), after being connected to the lower part (2) based on the composition thereof, exerts a predetermined force (F) onto the electronic component (6) in order to fix the position of said electronic component (6). As a result, the cover (1) is produced such that the applied force (F) lies in a predetermined force range (B) and that the clamping geometry comprises a groove (4) on the lower part (2) and a frame (5) on the cover (1) that also engages in the groove (4). A clamping web (3) on the lower part (2) or on the cover (1) is arranged in such a manner that the cover (1), after being connected to the lower part (2), is clamped in a releasable manner to the lower part by means of a clamping force (KF) that acts parallel to the force (F) acting upon the electronic component.
申请公布号 WO2008113336(A3) 申请公布日期 2009.01.15
申请号 WO2008DE00463 申请日期 2008.03.19
申请人 CONTI TEMIC MICROELECTRONIC GMBH;BUEYUEKBAS, TURHAN;RIETSCH, JUERGEN;KARRER, HELMUT;HENNIGER, JUERGEN;GRAMANN, MATTHIAS;WIECZOREK, MATTHIAS;SCHARRER, KLAUS;GUTH, PETER;TRODLER, DIRK 发明人 BUEYUEKBAS, TURHAN;RIETSCH, JUERGEN;KARRER, HELMUT;HENNIGER, JUERGEN;GRAMANN, MATTHIAS;WIECZOREK, MATTHIAS;SCHARRER, KLAUS;GUTH, PETER;TRODLER, DIRK
分类号 F16H61/00;G01D11/24;G12B9/08;H05K5/00 主分类号 F16H61/00
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