| 摘要 |
PROBLEM TO BE SOLVED: To provide a technology for manufacturing a printed circuit board including a landless through hole by a CBIC method. SOLUTION: In the printed circuit board, a circuit of copper is formed on both surfaces of an insulating body having a through hole. In the through hole, a connection body of copper which connects circuits on both front and rear surfaces is so formed as to fill the through hole. So the circuit and the connection body are metal-connected each other. The printed circuit board is characterized by including a landless through hole. COPYRIGHT: (C)2009,JPO&INPIT
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