发明名称 COMPONENT MOUNTING APPARATUS AND PRODUCTION FACILITY USING THE SAME
摘要 PROBLEM TO BE SOLVED: To solve the problem that it takes a long period of time mount solder balls on a single wiring board. SOLUTION: A component mounting apparatus includes a supply line 16 on which the solder balls 12 are supplied, a loading part 17 coupled with the terminal end of the supply line 16 for separately loading the solder balls 12 one by one, and a board mounting part 21 formed below the loading part 17 to which the wiring board 20 is mounted. At least one of the board mounting part 21 and the loading part 17 is movable in a horizontal direction, and in addition, the solder balls 12 are loaded to the wiring board 20 one by one at each movement. Thus, an expected purpose can be accomplished. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009009970(A) 申请公布日期 2009.01.15
申请号 JP20070167140 申请日期 2007.06.26
申请人 PANASONIC CORP 发明人 TAKENAKA AKIRA
分类号 H05K3/34 主分类号 H05K3/34
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