| 摘要 |
<p>Provided is a board-like heat treatment jig for a wafer. The jig supports the semiconductor silicon wafer by horizontally placing it on the jig for heat treatment. The jig has a doughnut shape with a hole penetrating the center portion. On a surface for placing the semiconductor silicon wafer, a ring-like protruding section is formed. The ring-like protruding section protrudes in a full-ring shape without a cut, and supports the placed semiconductor silicon wafer. The jig has three or more ring-like protruding sections which are concentrically formed with the same height.Thus, at the time of performing heat treatment to the semiconductor silicon wafer in a vertical heat treatment furnace, slip dislocation is suppressed. The vertical heat treatment boat provided with such jig is also provided.</p> |
