Elektronisches Bauteil und Systemträger sowie Verfahren zur Herstellung derselben

摘要

Electronic component comprises a plastic housing (2) and a metallic support (3) arranged in the housing. A semiconductor chip (4) is arranged on the metallic support using Flip-Chip technology. The support has outer contacts (5) in complete material thickness (D) and outer contacts (6) of reduced material thickness (d). The outer contacts are connected directly to flip-chip contacts (7) of the active upper side (8) of the semiconductor chip (4). Independent claims are also included for (1) a system support for several electronic components; and (2) a process for the production of the system support.