| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide: a semiconductor device which keeps good heat dissipation efficiency without increasing machining devices and a working man-hour, without increasing costs, and without impairing reliability; a display employing the semiconductor device; and a method for manufacturing the semiconductor device. <P>SOLUTION: In the semiconductor device 16 which has a conductive pattern 3 formed on the surface of a flexible insulating substrate 1 and also has a semiconductor 7 mounted on the surface of the insulating substrate 1 and connected with the conductive pattern, a slit 5 is formed in the insulating substrate to surround the semiconductor while leaving part around the semiconductor 7, thus providing a semiconductor holding part 30. Here, the slit 5 is formed in a U-shape such that the outward form surrounds three sides of the square semiconductor 7, for example. <P>COPYRIGHT: (C)2009,JPO&INPIT |
