发明名称 HEAT STAMPING OF STRUCTURE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a structure manufacturing method for manufacturing even a porous structure needed to form a special electrode or functional layer and so on in an easy manner. <P>SOLUTION: Disclosed is the method for transferring at least one transfer layer (22) from stamp foil (2), especially, heat stamp foil entirely or regionally to the surface of a substrate (1) to form a structure on a substrate, the transfer layer (22) having a region formed of a coupling agent in this case. Openings are formed in the transfer layer transferred onto the substrate (1) and the coupling agent is removed at this time. Then a filler is put in the openings. Further, the stamp foil is provided for forming the structure on the substrate. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2009010372(A) 申请公布日期 2009.01.15
申请号 JP20080157179 申请日期 2008.06.16
申请人 LEONHARD KURZ STIFTUNG & CO KG 发明人 SCHINDLER ULRICH
分类号 H01L21/027;B01J37/02 主分类号 H01L21/027
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