| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device equipped with several semiconductor elements whose space can be substantially saved while enabling efficient release of heat which is generated by operations of the semiconductor elements and to provide its manufacturing method. SOLUTION: The semiconductor device 1 includes a heatsink 20, transistors 10 as semiconductor elements which are mounted on a first major surface 20A and a second major surface 20B respectively, which are the major surfaces of both sides of the heatsink 20, and lead frames 50 which electrically connect the transistors 10 with the outside. COPYRIGHT: (C)2009,JPO&INPIT |
