发明名称 PHOTOSENSITIVE RESIN COMPOSITION AND MICROLENS FORMED WITH USE THEREOF
摘要 A photosensitive resin composition according to the present invention includes: a copolymer having a repeating unit having a thermal crosslinking group; and a photosensitive agent. As such, the photosensitive resin composition according to the present invention can form a resin with improved heat resistance. Further, a microlens-forming photosensitive resin composition according to the present invention includes: a copolymer having a repeating unit having a thermal crosslinking group; and a photosensitive agent, the copolymer having a mass-average molecular weight of 10,000 to 30,000. As such, the microlens-forming photosensitive resin composition according to the present invention can form a resin with improved heat resistance.
申请公布号 US2009017397(A1) 申请公布日期 2009.01.15
申请号 US20080167996 申请日期 2008.07.03
申请人 TOKYO OHKA KOGYO CO., LTD. 发明人 SUGIMOTO YASUAKI;KASE YUMIKO
分类号 G03C1/73;G03F7/20 主分类号 G03C1/73
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