Method for manufacturing doped semiconductor components involves providing semiconductor substrate and doping one side of semiconductor substrate with p- or n- doping

摘要

The method involves providing a semiconductor substrate and doping one side of the semiconductor substrate with p- or n -doping. A decal is provided, which is manufactured using a paste of organic binder and a powder such as glass powders or organically modified ceramic powders, which contains doping ions. The decal is applied on the cleaned side of the semiconductor substrate. The semiconductor substrate before endowing is roughened with the help of potassium hydroxide corrosion.