发明名称 Method for fabricating transistor
摘要 <p>PURPOSE: A method for manufacturing a transistor is provided to simplify process and to improve INWE(Inverse Narrow Width Effect) by using a nitride layer as a word line insulating layer. CONSTITUTION: A trench is formed by selectively etching a silicon substrate(1). The first thermal oxide layer(5), the first nitride layer(6), an oxide layer(7) and the second nitride layer(8) are sequentially formed on the resultant structure including the trench. A trench buried oxide layer(9) is then filled in the trench. The buried oxide layer, the second nitride layer and the oxide layer are sequentially etched. The thermal oxide layer(11) is formed on the exposed first nitride layer. Then, word lines are formed on the exposed substrate.</p>
申请公布号 KR100878498(B1) 申请公布日期 2009.01.15
申请号 KR20020086174 申请日期 2002.12.30
申请人 发明人
分类号 H01L21/76;(IPC1-7):H01L21/76 主分类号 H01L21/76
代理机构 代理人
主权项
地址