METHOD OF PRODUCTION DUAL LAYER FLEX CIRCUIT BOARD FOR CSP

摘要

A method for manufacturing dual layer flexible circuit board for CSP(Chip Scale Package) capable of confirming defect of via hole is provided to reduce manufacturing cost and to simplify manufacturing process by omitting PSR(Photo Solder Resist) process. A method for manufacturing dual layer flexible circuit board for CSP comprises the following steps: a step for forming a via hole in a designated position of flexible dual layer copper foil film using laser processing(S110); a step for copper-plating dual layer of the film and inner wall of the via hole(S120); a step for laminating a DF(Dry Film) film on a top film and a bottom film(S130); a step for forming a circuit pattern and a pad pattern on the top film and the bottom film by exposing and developing the DF film; a step for gold-plating the bottom film based on the pad pattern(S140); a step for inspecting gold plating state(S150); a step for exfoliating the DF film positioned on the bottom film and the top film of the circuit board(S160); a step for removing a copper pattern exposed by etching(S170); and a step for molding the circuit pattern of the top film using resin(S180).