PRINTED CIRCUIT BOARD AND ELECTRONIC APPARATUS

摘要

PROBLEM TO BE SOLVED: To secure a connection between a semiconductor package and a printed wiring board without applying an excessive amount of an adhesive. SOLUTION: The printed circuit board 15 includes: the printed wiring board 16; a semiconductor package 17 which has a plurality of solder balls 29 on the backside of the package and is mounted on the printed wiring board 16 by solder joining using the solder balls 29; a plurality of recessed portions 41 which are provided on a mount surface portion of the printed wiring board 16 where the semiconductor package 17 is mounted and disposed near an outer edge of the semiconductor package 17; and an adhesive made of a reinforcing material making a reinforcement connection between the mount surface portion and the backside of the package, the recessed portions 41 being filled with part of the adhesive 31. COPYRIGHT: (C)2009,JPO&INPIT