发明名称 METHOD AND APPARATUS FOR TESTING A SYSTEM MODULE
摘要 A method for testing a system module assembled by integrated circuits during mass production. The integrated circuits and the assembled system modules are manufactured by the same manufacturer. The method includes the steps of apply a plurality of system level tests to the system module to determine the performance of the system module. Next, verify the performance of the integrated circuits based on the results of the system level tests. Finally, perform integrated circuit level tests, wherein the integrated circuit level tests include test items unverifiable by the system level tests. The present invention also includes a testing apparatus for testing a system module.
申请公布号 US2009015235(A1) 申请公布日期 2009.01.15
申请号 US20070775115 申请日期 2007.07.09
申请人 AIRDIO WIRELESS INC. 发明人 TSAY WEN-JIUNN;CHANG DAVID YOW-CHERN;HWANG BAO-TAI;HUANG LING-HAUR
分类号 G01R31/28 主分类号 G01R31/28
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