LEAD FRAME AND SEMI-CONDUCTOR PACKAGE COMPRISING THE SAME

摘要

The lead frame and the semiconductor package are provided to increase the number of leads which perform the external circuit board and electrical contact and to manufacture the semiconductor package of the low cost. The second lead frame part(130) overlaps the first lead frame part(120) in the lead frame(100). The first lead frame part and the second lead frame part are fixed each other with the adhesive member(140). The die pad(110) is formed in order to support the semiconductor chip. It is supported by the pad supporting part(111) in the first lead frame part. The first lead frame part comprises the first lead(121) and the first dam bar(122) which maintains the interval between a plurality of first leads. A part of the first lead frame part is exposed to be electrically connected with the external circuit.