| 摘要 |
<p>The method involves forming or depositing insulation layers (31, 32) respectively on a support substrate (1) and a source substrate, and recovery heat treating of the layers. A front face of the layer (32) is adhered with a front face of the substrate (1) or a front face of the layer (31) after plasma activation. The substrates are adhered by molecular adhesion so that the layer (32) is situated between the substrates. A rear part of the source substrate is removed while retaining a thickness of material constituting an active layer (21) to obtain a composite substrate (4).</p> |
