| 摘要 |
A structure (100) for bound transmission of an RF electrical signal, the structure including a dielectric substrate (101) and an elongate conducting transmission portion (107) carried by the substrate. The transmission portion has an average thickness, measured perpendicular to a first face of the substrate, which is at least ten percent of an average width of the transmission portion. In a transmission line or other component made of microstrip form, the electrical current is concentrated near the surface and the side edges of the conducting metallic strip. This structure can show an improved insertion loss compared with prior art structure including a conventional microstrip transmission portion. The insertion loss is lower because the unusually greater height of the portion 107 allows the electrical current to be better distributed in the portion 107 giving a lower edge resistance and a lower inductance. Embodiments of the invention include the transmission line partially embedded within the substrate, a ground portion with a gap facing the transmission portion, and shielding carried by the substrate (parallel to transmission portion). |
